Device: MT29F1G16ABCHC [VFBGA63] (EPS-2)
Manufacturer: Micron
Part number description for this device:
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XXX | Product Family | 29F = Single-supply NAND flash memory29H = High speed NAND flash |
XX | Density | 1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8Gbit16G = 16Gbit32G = 32Gbit64G = 64Gbit128G = 128Gbit256G = 256Gbit |
XX | Device Width | 08 = 8 bits16 = 16 bits |
X | Classification | A = SLC, 1 die, 1 nCE, 1 RnB, 1 I/O channelB = SLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channelC = SLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channelD = SLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channelE = SLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channelsF = SLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channelG = SLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channelsJ = SLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channelK = SLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channelsZ = SLC, 1 die, n.a. nCE, n.a. RnB, 1 I/O channelM = MLC, 1 die, 1 nCE, 1 RnB, 1 I/O channelN = MLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channelP = MLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channelQ = MLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channelR = MLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channelsT = MLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channelU = MLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channelsV = MLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channelW = MLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channelsY = MLC, 8 dies, 4 nCE, 4 RnB, 1 I/O channel |
X | Operating Voltage Range | A = 3.3V (2.70V to 3.60V), VccQ 3.3V (2.70V to 3.60V)B = 1.8V (1.70V to 1.95V)C = 3.3V (2.70V to 3.60V), VccQ 1.8V (1.70V to 1.95V) |
X | Generation | A = 1st generationB = 2nd generationC = 3rd generationD = 4th generationetc. |
XX | Package Type | WC = 48-pin TSOP I (OCPL version) (Pb-free)WP = 48-pin TSOP I (CPL version) (Pb-free)HC = 63-ball VFBGA, 10.5x13x1.0H1 = 100-ball VFBGA (Pb-free), 12x18x1.0H2 = 100-ball TFBGA (Pb-free), 12x18x1.2C2 = 52-pad ULGA, 12x17x0.4C3 = 52-pad ULGA, 12x17x0.65C4 = 52-pad VLGA, 12x17x1.0C5 = 52-pad VLGA, 14x18x1.0C6 = 52-pad LLGA, 14x18x1.47C7 = 48-pad LLGA, 12x20x1,47SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free)SWP = 48-pin Stacked TSOP (CPL version) (Pb-free) |
XX | Speed Grade (MT29H only) | 15 = 133 MT/s12 = 166 MT/s |
XX | Flash Performance | Blank = Full spec |
XX | Block Option | Blank = Standard device |
XX | Temperature Range | Blank = Commercial (0°C to 70°C)ET = Extended (-40°C to 85°C)WT = Wireless (-25°C to 85°C) |
XX | Production Status | Blank = ProductionES = Engineering samplesMS = Mechanical samplesQS = Qualification samples |
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X | Device Revision | A = 1st design revisionB = 2nd design revisionetc. |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
BeeHive208S | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
BeeProg2 | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
BeeProg2C | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |